Flagless semiconductor package
US4924291A · kind A · utility
25Cited by
7References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 24, 1988 |
| Grant date | May 8, 1990 |
| Priority date | — |
| Expiry date | Oct 24, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A molded semiconductor package having a flagless leadframe wherein a semiconductor die is disposed in or above a die opening of a leadframe. This allows for thin, symmetrical packages and packages having a minimum number of material interfaces to be manufactured because no leadframe flags and minimal die bond material are employed. The present invention further includes guard rings to protect high stress areas of the semiconductor die from damage and heat spreaders to more effectively spread heat dissipated by the semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.