Method for making metal core printed circuit board

US4924590A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Helmut Hadwiger · Munich, DE
• Hans-Fr. Schmidt · Eurasburg, DE

Key dates

• Filing date: Dec 28, 1988
• Grant date: May 15, 1990
• Expiry date: Dec 28, 2008

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31721
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

A method for the manufacturing of a metal core pc board which provides for manufacturing of two or three dimensional metal core pc boards of any form with or without throughplating. The manufacturing of such pc boards can occur by injection molding, injection/compressing molding or by a pressing method. High-heat resistant thermoplastics, as well as duroplastics are preferably employed as pc board materials. A metal with good thermal conductibility is used for the core. The material is selected such that the thermal expansion coefficients of the metal core and the pc board material are optimally equal. The manufacturing contains the following steps: lamination of the metal plate with a plastic foil on one or both sides; introduction of the desired hole pattern with a corresponding over dimension into the laminated metal plate; placing of such prepared metal core in an injection molding tool; and thermoforming the plastic on the laminated core over the plastic foil and simultaneously filling out the holes to a final dimension with the plastic.