Hans-Fr. Schmidt
8Patents
7h-index
16Co-inventors
52Inventor score
Filing activity: Dec 3, 1987 → Jan 8, 1992
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4996391A | Printed circuit board having an injection molded substrate | Emerging Cross-Sectional Technologies | 125 | Expired |
| US5008496A | Three-dimensional printed circuit board | Emerging Cross-Sectional Technologies | 66 | Expired |
| US4853252A | Method and coating material for applying electrically conductive printed patterns to insulating substrates | Electricity | 23 | Expired |
| US5044074A | Method for manufacturing metal core printed circuit boards | Emerging Cross-Sectional Technologies | 13 | Expired |
| US5134056A | Method for applying a solder resist layer to a printed circuit board | Electricity | 11 | Expired |
| US5106785A | Method for encapsulating electronic components or assemblies using a thermoplastic encapsulant | Emerging Cross-Sectional Technologies | 8 | Expired |
| US5376824A | Method and an encapsulation for encapsulating electrical or electronic components or assemblies | Emerging Cross-Sectional Technologies | 7 | Expired |
| US4924590A | Method for making metal core printed circuit board | Emerging Cross-Sectional Technologies | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.