Flip substrate for chip mount
US4926241A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 19, 1988 |
| Grant date | May 15, 1990 |
| Priority date | — |
| Expiry date | Feb 19, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/112
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate for attaching electrical devices having an interconnect wiring structure and a support for the interconnect, the support having a number of vias, or throughholes, extending therethrough and electrically connected to the interconnect. The substrate allows for attachment of the electrical devices on the side of the support opposite the interconnect at the vias, rather than on the interconnect itself. By so doing, the chips can be packed more densely since the area between the chips normally reserved for engineering change pads, test pads and the like is not required, these functions being performed on the interconnect on the opposite side of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.