Pad material for grinding, lapping and polishing
US4927432A · kind A · utility
139Cited by
14References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 1986 |
| Grant date | May 22, 1990 |
| Priority date | — |
| Expiry date | Mar 25, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/2033
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An improved polishing pad material is produced by modifying conventional poromeric materials in which a porous thermoplastic resin matrix, typically polyurethane, is reinforced with a fibrous network such as a felted mat of polyester fibers. The polishing material is modified by coalescing the resin among the fibers, preferably by heat treatment, to increase the porosity and hardness of the material as well increasing the surface activity of the resin. The polishing material may also incorporate polishing aids such as particulate abrasives and may also be used as a lapping or grinding material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.