Method for manufacture of printed circuit boards
US4931148A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 1988 |
| Grant date | Jun 5, 1990 |
| Priority date | — |
| Expiry date | Sep 27, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S205/926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Printed circuit boards containing thru-holes requiring metallization are manufactured by first applying to the board material an alkaline strippable resist in a predetermined desired pattern, thereafter applying material catalytic to subsequent metallization, thereafter treating the board with an aqueous alkaline solution to remove catalytic material from resist surfaces without adversely affecting the catalyst at non-resist areas, and then metallizing the non-resist areas. The ability to preliminarily apply the resist pattern before catalyst application, metallization, etc., yet prevent metallization of the resist, enables the manufacturing process to proceed straight through the activation, metallization, etc. steps without need for interruption for resist application.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.