Sensitizing activator composition for chemical plating
US4933010A · kind A · utility
15Cited by
4References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 2, 1988 |
| Grant date | Jun 12, 1990 |
| Priority date | — |
| Expiry date | Sep 2, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/427
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a sensitizing activator for chemical plating operations, that uniformly and efficiently deposits a substance capable of catalytically depositing a plating metal from a plating solution, such as colloidal palladium, on the surface of a material to be plated. The activator includes stannous chloride and palladium chloride colloidally dispersed in a dilute solution of sulfuric acid and sodium chloride. The activator advantageously avoids corrosion of the black oxide that is formed on the inner copper foil of copper-clad laminates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.