Eric F. Harnden
5Patents
0Active
5Granted
26Portfolio score
Filing activity: Sep 2, 1988 → Mar 13, 1996
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5342501A | Method for electroplating metal onto a non-conductive substrate treated with basic accelerating solutions for metal plating | Emerging Cross-Sectional Technologies | 25 | Expired |
| US4933010A | Sensitizing activator composition for chemical plating | Electricity | 15 | Expired |
| US5795405A | Machine and method for processing of printed circuit boards by immersion in transversely flowing liquid chemical | Emerging Cross-Sectional Technologies | 9 | Expired |
| US5268088A | Simplified method for direct electroplating of acrylic or epoxy containing dielectric substrates | Emerging Cross-Sectional Technologies | 9 | Expired |
| US5262042A | Simplified method for direct electroplating of dielectric substrates | Electricity | 5 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.