System for mechanical planarization
US4934102A · kind A · utility
109Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 4, 1988 |
| Grant date | Jun 19, 1990 |
| Priority date | — |
| Expiry date | Oct 4, 2008 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B7/228
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing tool for abrasively polishing a semiconductor wafer that edge clamps the wafer between two rollers. The wafer is spun-up in one plane and the rollers spin in a second plane which is orthogonal to the wafer spin plane. One of the rollers is split with each section rotating in opposite directions. Each of the rollers is mounted by a spring-gimballed assembly to follow the wafer contour.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.