Aluminum alloy semiconductor packages
US4939316A · kind A · utility
67Cited by
16References
42Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 1988 |
| Grant date | Jul 3, 1990 |
| Priority date | — |
| Expiry date | Oct 5, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a package adapted to house an electronic device, such as a semiconductor integrated circuit. The package components are comprised of aluminum or an aluminum based alloy. At least a portion of the surfaces of the package components are anodized to enhance corrosion resistance and increase bond strength. The aluminum based packages are characterized by lighter weight than copper based packages and better thermal conductivity than plastic based packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.