Enhanced air fin cooling arrangement for a hermetically sealed modular electronic cold plate utilizing reflux cooling
US4941530A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 13, 1989 |
| Grant date | Jul 17, 1990 |
| Priority date | — |
| Expiry date | Jan 13, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A modular reflux cooling plate (10) having a condenser region (11) above the boiling channels (12) or above and below (11,24) the region (11), boiling channels (12) and downcomers (16) which effect reflux cooling of electrical power modules used in aircraft and the like. Air flow fins (18) are arranged adjacent the condenser (11) or condensers (11,24) and the boiling channels (12) to effect cooling of a coolant vapor which has entered the condenser (11) after being boiled from a liquid state in the boiling channels (12) as a result of the heat generated by one or more power modules affixed to an end plate (14) by any suitable means and to provide a parallel heat transfer path which shares the heat transfer task with the reflux cooling during normal system operation and which provides emergency heat transfer when reflux cooling is not available.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.