Inventor · Lindenwood, IL, US

Lawrence E. Crowe

19Patents
9h-index
8Co-inventors
57Inventor score

Filing activity: Sep 22, 1986 → Jan 31, 1994

Most-cited inventions

PatentTitleAreaCited byStatus
US5184291A Converter and inverter support module Electricity 64 Expired
US5466974A Electric power distribution module for an electric power generation and distribution system Electricity 54 Expired
US4941530A Enhanced air fin cooling arrangement for a hermetically sealed modular electronic cold plate utilizing reflux cooling Electricity 45 Expired
US4944344A Hermetically sealed modular electronic cold plate utilizing reflux cooling Electricity 29 Expired
US4975825A Stacked power converter Electricity 23 Expired
US5271248A Dual cooling system Electricity 18 Expired
US5119286A Modular circuit board Electricity 10 Expired
US4975824A Power converter circuit board Electricity 10 Expired
US5660227A Heat exchanger for high power electrical component Emerging Cross-Sectional Technologies 9 Expired
US4901201A Plate fin/chic heat exchanger Electricity 8 Expired
US4979090A Power converter circuit board Electricity 8 Expired
US4830979A Method of manufacturing hermetically sealed compression bonded circuit assemblies Emerging Cross-Sectional Technologies 7 Expired
US4712384A Integrated evaporator and thermal expansion valve assembly Mechanical Engineering; Lighting; Heating 7 Expired
US5749413A Heat exchanger for high power electrical component and package incorporating same Emerging Cross-Sectional Technologies 6 Expired
US4935842A High current feed-through capacitor Electricity 5 Expired
US5034803A Compression bonded semiconductor device having a plurality of stacked hermetically sealed circuit assemblies Emerging Cross-Sectional Technologies 4 Expired
US5053358A Method of manufacturing hermetically sealed compression bonded circuit assemblies Emerging Cross-Sectional Technologies 3 Expired
US4985752A Hermetically sealed compression bonded circuit assembly having a suspension for compression bonded semiconductor elements Electricity 2 Expired
US4954876A Hermetically sealed compression bonded circuit assembly having flexible walls at points of application of pressure for compression bonding circuit elements Emerging Cross-Sectional Technologies 1 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.