Lead frame and semiconductor device
US4942452A · kind A · utility
48Cited by
4References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 22, 1988 |
| Grant date | Jul 17, 1990 |
| Priority date | — |
| Expiry date | Feb 22, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame and a semiconductor device wherein a through hole is formed in the center of a semiconductor chip-mounting surface of a chip pad at the center of the lead frame, the through hole being tapered or being one which corresponds to a surface area that is greater on the surface of the chip-mounting surface of the chip pad than on the surface of the side opposite to the chip-mounting surface thereof. This prevents the occurrence of cracks in the sealing plastic portion in the step of reflow soldering of the lead frame to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.