Asao Nishimura
144Patents
29h-index
139Co-inventors
93Inventor score
Filing activity: Mar 12, 1986 → Jun 21, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5608265A | Encapsulated semiconductor device package having holes for electrically conductive material | Emerging Cross-Sectional Technologies | 422 | Expired |
| US5068712A | Semiconductor device | Emerging Cross-Sectional Technologies | 120 | Expired |
| US5571428A | Semiconductor leadframe and its production method and plastic encapsulated semiconductor device | Emerging Cross-Sectional Technologies | 109 | Expired |
| US6335565B1 | Semiconductor device | Electricity | 106 | Expired |
| US6413850B1 | Method of forming bumps | Electricity | 84 | Expired |
| US6798072B2 | Flip chip assembly structure for semiconductor device and method of assembling therefor | Electricity | 79 | Expired |
| US5347429A | Plastic-molded-type semiconductor device | Electricity | 71 | Expired |
| US5159434A | Semiconductor device having a particular chip pad structure | Electricity | 61 | Expired |
| US6627997B1 | Semiconductor module and method of mounting | Electricity | 58 | Expired |
| US5041901A | Lead frame and semiconductor device using the same | Emerging Cross-Sectional Technologies | 54 | Expired |
| US5357139A | Plastic encapsulated semiconductor device and lead frame | Electricity | 54 | Expired |
| US5299092A | Plastic sealed type semiconductor apparatus | Electricity | 50 | Expired |
| US5488254A | Plastic-molded-type semiconductor device | Electricity | 50 | Expired |
| US4942452A | Lead frame and semiconductor device | Electricity | 48 | Expired |
| US5358904A | Semiconductor device | Emerging Cross-Sectional Technologies | 44 | Expired |
| US6621154B1 | Semiconductor apparatus having stress cushioning layer | Electricity | 44 | Expired |
| US5539250A | Plastic-molded-type semiconductor device | Electricity | 43 | Expired |
| US7138722B2 | Semiconductor device | Electricity | 42 | Expired |
| US5530286A | Semiconductor device | Emerging Cross-Sectional Technologies | 41 | Expired |
| US6831294B1 | Semiconductor integrated circuit device having bump electrodes for signal or power only, and testing pads that are not coupled to bump electrodes | Electricity | 41 | Expired |
| US5895965A | Semiconductor device | Electricity | 40 | Expired |
| US6211576A | Semiconductor device | Electricity | 36 | Expired |
| US5047837A | Semiconductor device with heat transfer cap | Electricity | 33 | Expired |
| US6861742B2 | Wafer level chip size package having rerouting layers | Electricity | 31 | Expired |
| US5437915A | Semiconductor leadframe and its production method and plastic encapsulated semiconductor device | Emerging Cross-Sectional Technologies | 31 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.