IC package
US4942453A · kind A · utility
22Cited by
6References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 15, 1988 |
| Grant date | Jul 17, 1990 |
| Priority date | — |
| Expiry date | Sep 15, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device for packaging many memory IC chips having a plurality of common connecting terminals on a main circuit board. A plurality of IC chips are packaged on an auxiliary board to make an IC chip unit, and a plurality of IC chip units are aligned on the main circuit board. The connections between unit-connecting terminals provided on the respective IC chip units and the main circuit board are made by means of wiring patterns on the main circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.