Hermetically sealed modular electronic cold plate utilizing reflux cooling
US4944344A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 31, 1988 |
| Grant date | Jul 31, 1990 |
| Priority date | — |
| Expiry date | Oct 31, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A modular reflux cooling plate (10) having a condensing region (11), boiling channels (12) and downcomers (16) which effect reflux cooling of electrical power modules used in aircraft and the like. The condenser (11) and boiling channels (12) can be constituted by longitudinally disposed lanced offset fins (20). Air flow fins (18) are arranged adjacent the condenser (11) to effect cooling of a coolant vapor which has entered the condenser (11) after being boiled from a liquid state in the boiling channels (12) as a result of the heat generated by one or more power modules affixed to an end plate (14) by any suitable means. Temporary thermal storage can be provided in the form of either a thickened end plate (14) or a chamber having lanced offset fins (25) and a normally solid or semi-solid material such as wax or solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.