Multi-fiber alignment package for optoelectronic components
US4944569A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 18, 1989 |
| Grant date | Jul 31, 1990 |
| Priority date | — |
| Expiry date | Aug 18, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/93
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A localized cooling method allows the sequential alignment and soldering of one optical fiber at a time to a semiconductor package, while previously aligned and soldered optical fibers are held fixed. This method utilizes the mechanical property of a sharp melting point eutectic alloy solder or a pure metal solder for the fiber connections and is effective for multi-fiber optoelectronic packages demanding stability and high precision. A package design for optoelectronic components requiring multi-fiber alignment incorporates this feature of localized cooling internally. The localized cooling method and the novel package utilizing this method internally make it possible to eliminate the tilted angle optical fiber alignment problem by mounting tilted facet optical amplifier components at a predetermined offset angle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.