Method for grinding the surface of a semiconductor wafer
US4947598A · kind A · utility
13Cited by
2References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 19, 1983 |
| Grant date | Aug 14, 1990 |
| Priority date | — |
| Expiry date | Apr 19, 2003 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D7/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A dresser made of bonded alundum-type abrasive is ground by a rotating blade made of bonded super abrasive to dress the blade. The surface of a semiconductor wafer is ground by the rotating dressed blade to convert it into a matte-finished surface substantially free from saw marks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.