Substrate transport and cooling apparatus and method for same
US4949783A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 18, 1988 |
| Grant date | Aug 21, 1990 |
| Priority date | — |
| Expiry date | May 18, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68792
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A loading station receives a substrate into a load-lock volume pressure isolated from a loading station chamber which is open to a processing chamber. The volume is evacuated and the substrate lowered into the loading chamber. A transport arm moves the substrate from the loading station to a substrate carrier of a cooling fixture within the processing chamber. The carrier is connected to a clamp which together move vertically downward to lower the wafer onto a substrate seat of the fixture. During substrate processing the fixture is tiltable and rotatable and provides substrate cooling by solid-to-solid conduction, forced convection and free convection. Solid-to-solid conduction is provided by the clamp. The substrate is pressed to the fixture by the cooling clamp having a circulating cooling fluid. Forced convection is provided by a gas flowing into the microscopic areas between the substrate and the fixture at a pressure high enough to cause bowing or lifting of the substrate and thus to create a gas region between the substrate and the fixture. An O-ring provides a seal under the pressure of the clamps near the periphery of the substrate to substantially seal the gas from enteri…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.