Resin-encapsulated semiconductor device
US4951122A · kind A · utility
46Cited by
2References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 1988 |
| Grant date | Aug 21, 1990 |
| Priority date | — |
| Expiry date | May 27, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a technique in which the pellet fixing parts of a lead frame of the tabless type or the type having no die pads are molded in or coated with a resin beforehand in order to enhance the reliability of a resin-encapsulated IC having become important with enlargement in the size of the chip of a memory IC or the like and reduction in the size of a resin package, and a resin package structure in which the technique of the lead frame having no die pads is applied to flat packaging so as to lessen reflow cracks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.