Polishing pad for semiconductor wafers
US4954141A · kind A · utility
128Cited by
5References
6Claims
0Family size
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Key dates
| Filing date | Jan 25, 1989 |
| Grant date | Sep 4, 1990 |
| Priority date | — |
| Expiry date | Jan 25, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S451/921
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad for a semiconductor wafer, which pad is made of a foamed fluorine-contained resin sheet and is highly resistant to a corrosive polishing solution such as bromine-methanol system or bromine-methanol-silica powder system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.