Kunihiro Miyazaki
40Patents
12h-index
54Co-inventors
84Inventor score
Filing activity: Jul 11, 1986 → Jul 27, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4954141A | Polishing pad for semiconductor wafers | Emerging Cross-Sectional Technologies | 128 | Expired |
| US4902649A | Hard tissue substitute composition | Human Necessities | 46 | Expired |
| US5686314A | Surface processing method effected for total-reflection X-ray fluorescence analysis | Emerging Cross-Sectional Technologies | 28 | Expired |
| US4915710A | Abrasive composition and process for polishing | Chemistry; Metallurgy | 25 | Expired |
| US4929257A | Abrasive composition and process for polishing | Chemistry; Metallurgy | 21 | Expired |
| US5868855A | Surface processing method and surface processing device for silicon substrates | Electricity | 21 | Expired |
| US5732120A | Fluorescent X-ray analyzing apparatus | Physics | 19 | Expired |
| US4935039A | Abrasive composition and process for polishing plastic article | Chemistry; Metallurgy | 17 | Expired |
| US5497407A | Contaminating-element analyzing method | Physics | 15 | Expired |
| US5457726A | Analyzer for total reflection fluorescent x-ray and its correcting method | Physics | 14 | Expired |
| US5430786A | Element analyzing method | Physics | 14 | Expired |
| US5632868A | Method and apparatus for generating ozone and methods of its use | Chemistry; Metallurgy | 13 | Expired |
| US6444047B1 | Method of cleaning a semiconductor substrate | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6832616B2 | Substrate treating apparatus | Emerging Cross-Sectional Technologies | 10 | Expired |
| US5422925A | Contaminating-element analyzing method and apparatus of the same | Physics | 8 | Expired |
| US7619896B2 | Electrical junction box | Electricity | 8 | Active |
| US5792326A | Method and apparatus for generating ozone and methods of its use | Chemistry; Metallurgy | 8 | Expired |
| US4883502A | Abrasive composition and process for polishing | Chemistry; Metallurgy | 6 | Expired |
| US5636256A | Apparatus used for total reflection fluorescent X-ray analysis on a liquid drop-like sample containing very small amounts of impurities | Physics | 6 | Expired |
| US6645876B2 | Etching for manufacture of semiconductor devices | Electricity | 4 | Expired |
| US10281210B2 | Substrate processing apparatus and substrate processing method | Electricity | 3 | Active |
| US4774068A | Method for production of mullite of high purity | Chemistry; Metallurgy | 3 | Expired |
| US5528648A | Method and apparatus for analyzing contaminative element concentrations | Physics | 2 | Expired |
| US7902030B2 | Manufacturing method for semiconductor device and semiconductor device | Electricity | 2 | Active |
| US5490194A | Method and apparatus for analyzing contaminative element concentrations | Physics | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.