Electroless copper plating solution
US4956014A · kind A · utility
6Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 20, 1989 |
| Grant date | Sep 11, 1990 |
| Priority date | — |
| Expiry date | Mar 20, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/40
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A practically fast electroless copper plating solution is provided by adding a specific monoamine as an accelerator. The accelerator should be a tertiary monoamine and cannot be a diamine, does not have a complexing ability for copper ion, and does not contain a ketone or carboxyl group or an unsaturated group. Specific examples of such monoamines include triethylamine, tripropylamine, tribenzylamine, N-methylpiperidine, and diethylaminoethanol.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.