Integrated circuit having an improved bond pad
US4959706A · kind A · utility
11Cited by
1References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 1988 |
| Grant date | Sep 25, 1990 |
| Priority date | — |
| Expiry date | May 23, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20753
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved bond pad on an integrated circuit has an elongated rectangular shape, on which the wire is bonded at a non-central location displaced toward an outer corner, so that there is room on the pad for a second bond site to be used for a rework bond. The pad corner closest to the path of a wire may be chamfered to reduce the distance of closest approach.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.