Hermetic microminiature packages
US4967260A · kind A · utility
61Cited by
20References
32Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 4, 1988 |
| Grant date | Oct 30, 1990 |
| Priority date | — |
| Expiry date | May 4, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A hermetic tape package and a process for forming the hermetic tape package are disclosed. The package is capable of high lead densities and occupies a minimum of space. A test frame is incorporated into the package to permit testing of an electronic device prior to sealing the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.