Tape carrier for assembling an IC chip on a substrate
US4967261A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 22, 1989 |
| Grant date | Oct 30, 1990 |
| Priority date | — |
| Expiry date | Nov 22, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A tape carrier for mounting and bonding an IC chip on substrate having an interconnection pattern is disclosed. The tape carrier comprises a peripheral and a central film portion made of an electrically insulating flexible material, and a set of leads carried at least one the peripheral film portion. The central portion covers the central area of the surface of the IC chip on which the bumps are formed. An aperture is formed between the peripheral and central film portion which has enough dimension to allow the leads to be bonded to the bumps of the IC chip therethrough. Some of the leads extend over the central film portion and, extending out of a side of the central film portion, reach the opposing area of the peripheral film portion across a strip of the aperture, thereby effecting electrical connection from the bumps to far-away portions of the circuitry on the substrate and between the bumps themselves. The central film portion may form an island separated from the peripheral potion by a ring-shaped aperture; alternatively, it may form a tongue-shaped appendage projecting into the aperture. The leads and the IC chip may be situated on the same surface of the film portions; alt…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.