Use of tapered head pin design to improve the stress distribution in the braze joint
US4970570A · kind A · utility
27Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 16, 1989 |
| Grant date | Nov 13, 1990 |
| Priority date | — |
| Expiry date | Oct 16, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3426
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention teaches a structure for reducing the stresses created on a substrate and on the bonding surface at which a connector is attached. The connector has a tapered or beveled head thereby tapering the stress away from the edges of the bonding surface and therefore away from the high stress areas of the substrate, preventing cracking and delamination problems that might otherwise result. The tapered-head geometry also allows greater flexibility in manufacturing the connectors particularly when fabricating pins using a cold-heading process in that a quarter shank diameter:pin head diameter ratio can be obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.