Semiconductor device
US4970575A · kind A · utility
83Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 9, 1990 |
| Grant date | Nov 13, 1990 |
| Priority date | — |
| Expiry date | Apr 9, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate and semiconductor chips are connected by solder bumps and a vacant space around the solder bumps is coated with resin in such a degree that the tops of the semiconductor chips are not coated therewith. Epoxy resin or a resin having a smaller thermal expansion coefficient than the epoxy resin is used in the resin coating, and an inorganic material having a smaller thermal expansion coefficient than said resin is mixed therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.