Patent · US Expired

Process for preserving the surface of silicon wafers

US4973563A · kind A · utility

34Cited by

7References

8Claims

0Family size

Assignee

Wacker Chemitronic Gesellschaft · DE

Inventors

Helene Prigge · Unterschleißheim, DE
Anton Schnegg · Burghausen, DE
Gerhard Brehm · Emmerting, DE

Key dates

Filing date	Jun 20, 1989
Grant date	Nov 27, 1990
Priority date	—
Expiry date	Jun 20, 2009

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A process for preserving the surface of silicon wafers after the wafers are polished in a conventional polishing operation by converting the wafer surface to the hydrophobic state, in particular, by polishing, or with hydrofluoric acid and treating immediately afterwards with a reagent, e.g., alcohols, organosilanes or silanols and preferably in aqueous solution. The wafer becomes coated in this process with a protective layer which inhibits surface deterioration, and also permits long storage times.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.