Process for metallizing non-conductive substrates
US4976990A · kind A · utility
43Cited by
8References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 29, 1989 |
| Grant date | Dec 11, 1990 |
| Priority date | — |
| Expiry date | Mar 29, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/427
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Non-conductive surfaces, particularly through-hole surfaces in double-sided or multi-layer printed circuit board, are treated (conditioned) to receive void-free, adherent electroless metal coatings by contact of the surfaces with an organosilane preparatory to catalyzation and metallization.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.