High-density, multi-level interconnects, flex circuits, and tape for TAB
US4980034A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 4, 1989 |
| Grant date | Dec 25, 1990 |
| Priority date | — |
| Expiry date | Apr 4, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/095
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layer interconnect structure of alternating dielectric (e.g., polyimide) and metal (e.g., copper) is built on a substrate supporting a continuous layer of metal. This metal layer is used as an electrode for plating vias through all the dielectric layers. Once the desired number of layers are formed, the substrate is removed and the continuous metal layer is patterned. Solid metal vias having nearly vertical side walls can be stacked vertically, producing good electrical and thermal transfer paths and permitting small, closely-spaced conductors. Further, by mixing geometrical shapes of conductors, a variety of useful structures can be achieved, such as controlled impedance transmission lines and multiconductor TAB tape with interconnects on tape of different dimensions than TAB fingers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.