Hermetically sealed compression bonded circuit assembly having a suspension for compression bonded semiconductor elements
US4985752A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 1, 1988 |
| Grant date | Jan 15, 1991 |
| Priority date | — |
| Expiry date | Aug 1, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A harmetically sealed circuit assembly (10) containing a plurality of circuit elements (74, 76 and 80) which are to be compression bonded upon application of a force through opposed first and second walls (12, 20) of a hermetically sealed chamber containing the circuit elements to be compression bonded in accordance with the invention includes a plurality of columns (20-30) within the chamber with each circuit element to be compression bonded being disposed in a separate column; an inelastically deformed element (124-132) positioned in each of the columns outside the chamber having a first surface facing an outside surface of one of the first and second walls of the hermetically sealed chamber and a second surface with each of the second surfaces of the deformed springs facing an outside surface of another of the first and second walls; and a thickness of the columns measured between the outside surfaces of the first and second walls prior to compression bonding being substantially identical.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.