Leadframe system with multi-tier leads
US4987473A · kind A · utility
23Cited by
3References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 3, 1989 |
| Grant date | Jan 22, 1991 |
| Priority date | — |
| Expiry date | Aug 3, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The leadframe of this invention includes a die attach pad and leads with lead tips in the vicinity of the pad. Alternate lead tips have been bent upwards into one plane and the remaining lead tips are bent downwards into a different plane. This design enables a denser packing of lead tips without fear of electrical shorts than the conventional design where the lead tips are in the same plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.