VLSI Technology, Inc.
🏢 View company profile →1,089Patents
0Active
1,089Granted
48Portfolio score
Filing activity: May 30, 1984 → Feb 8, 2001
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5841663A | Apparatus and method for synthesizing integrated circuits using parameterized HDL modules | Physics | 333 | Expired |
| US5200809A | Exposed die-attach heatsink package | Electricity | 266 | Expired |
| US5332864A | Integrated circuit package having an interposer | Electricity | 264 | Expired |
| US5624582A | Optimization of dry etching through the control of helium backside pressure | Electricity | 257 | Expired |
| US5404460A | Method for configuring multiple identical serial I/O devices to unique addresses through a serial bus | Physics | 252 | Expired |
| US5615263A | Dual purpose security architecture with protected internal operating system | Physics | 243 | Expired |
| US5646831A | Electrically enhanced power quad flat pack arrangement | Electricity | 227 | Expired |
| US6292766A | Simulation tool input file generator for interface circuitry | Emerging Cross-Sectional Technologies | 212 | Expired |
| US5414299A | Semi-conductor device interconnect package assembly for improved package performance | Electricity | 211 | Expired |
| US6297170A | Sacrificial multilayer anti-reflective coating for mos gate formation | Electricity | 205 | Expired |
| US6212633A | Secure data communication over a memory-mapped serial communications interface utilizing a distributed firewall | Electricity | 184 | Expired |
| US6057598A | Face on face flip chip integration | Electricity | 177 | Expired |
| US6182264A | Smart dynamic selection of error correction methods for DECT based data services | Electricity | 173 | Expired |
| US6069407A | BGA package using PCB and tape in a die-up configuration | Emerging Cross-Sectional Technologies | 169 | Expired |
| US5537580A | Integrated circuit fabrication using state machine extraction from behavioral hardware description language | Physics | 169 | Expired |
| US5994766A | Flip chip circuit arrangement with redistribution layer that minimizes crosstalk | Electricity | 160 | Expired |
| US4745084A | Method of making a customized semiconductor integrated device | Electricity | 157 | Expired |
| US6127811A | Micro-electromechanical system and voltage shifter, method of synchronizing an electronic system and a micromechanical system of a micro-electromechanical system | Electricity | 156 | Expired |
| US5612893A | Method and apparatus for compacting integrataed circuits with transistor sizing | Physics | 152 | Expired |
| US5625568A | Method and apparatus for compacting integrated circuits with standard cell architectures | Physics | 144 | Expired |
| US5963104A | Standard cell ring oscillator of a non-deterministic randomizer circuit | Physics | 142 | Expired |
| US5420460A | Thin cavity down ball grid array package based on wirebond technology | Electricity | 138 | Expired |
| US6108738A | Multi-master PCI bus system within a single integrated circuit | Physics | 134 | Expired |
| US5519627A | Datapath synthesis method and apparatus utilizing a structured cell library | Physics | 131 | Expired |
| US5689091A | Multi-layer substrate structure | Emerging Cross-Sectional Technologies | 128 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.