Photosensitive resin composition with o-quinone diazide and novolac resins prepared from mixed phenolic reactants to include 3,5-xylenol and 2,5-xylenol
US4988601A · kind A · utility
23Cited by
3References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 25, 1988 |
| Grant date | Jan 29, 1991 |
| Priority date | — |
| Expiry date | Nov 25, 2008 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0236
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photosensitive resin composition having high heat resistance, sensitivity, and resolution performance, including a novolak resin prepared by condensing 2,5-xylenol with m-cresol and/or p-cresol using a carbonyl compound, a novolak resin prepared by condensing 3,5-xylenol with m-cresol and/or p-cresol, and a photosensitive reagent. In addition, four other types of photosensitive resin compositions are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.