Method for fabricating a fold-up frame
US4991291A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 1989 |
| Grant date | Feb 12, 1991 |
| Priority date | — |
| Expiry date | Dec 29, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49789
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method is disclosed for easy and inexpensive fabrication of fold-up frames having diverse geometric configurations for flat packs (metal packages) for housing discrete and integrated circuit chips. The method includes a first step of cutting a piece of flat metallic stock to predetermined length and width consistent with the number of fold-up frames and the perimeter required for the specific fold-up frame configuration to be fabricated, respectively. The flat stock is then milled to form a plurality of grooves of predetermined angle lengthwise in at least one major surface thereof to define the number of sidewall members in the final configuration of the fold-up frame. The milled flat stock may then be sliced to form a plurality of individual milled frames each having the predetermined height required by the specific configuration fold-up frame. Apertures are formed in the milled frame by punching or piercing all sidewall members simultaneously in a single operation. In a variation of the above-described method, the apertures are simultaneously punched in the milled flat stock prior to slicing thereof. The apertured, milled frame is then folded along the respective grooves to fo…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.