Method of manufacturing a circuit board
US4993148A · kind A · utility
90Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 1989 |
| Grant date | Feb 19, 1991 |
| Priority date | — |
| Expiry date | Sep 12, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method is provided for forming a circuit board which comprises a copper plate and an insulating layer of photosensitive polyimide resin formed on the copper plate, the insulating layer leaving an exposed portion of a surface of the copper plate where an LSI is to be mounted. After Au plating is applied to the exposed surface of the copper plate, the LSI is mounted fixedly. A connection pattern having bonding pads is formed by copper plating on the insulating layer. The bonding pads and the LSI are connected by Au wire bonding on the Au plating applied on the bonding pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.