High density planar interconnect
US4993958A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 23, 1990 |
| Grant date | Feb 19, 1991 |
| Priority date | — |
| Expiry date | May 23, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/2414
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A deformable connector provides a concentrated wiping action pressure during the connection process, yet forms a flat mating surface when it is fully mated, and that is also suitable for providing a double density connection between a printed circuit board and a flexible circuit cable, as well as other applications. The connector includes an elastomeric member whose lower surface has a first convex region at one end, a second convex region at the other end, and a concave region in a middle joining the first and second convex regions. The upper surface contains a convex region in its middle that is approximately parallel to the concave region of the lower surface, producing an approximately constant thickness over most of the length of the elastomeric member, thus forming a flat mating surface in its fully mated condition. Conductive runs to be connected to a mating surface are disposed on the lower surface of a flexible circuit or cable affixed to the lower surface of the elastomeric member. A frame member and fastening means apply downward pressure to the convex region of the upper surface of the elastomeric member and thereby cause the first and second regions of the lower surfac…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.