Molded integrated circuit package incorporating decoupling capacitor
US4994936A · kind A · utility
58Cited by
3References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 12, 1990 |
| Grant date | Feb 19, 1991 |
| Priority date | — |
| Expiry date | Feb 12, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/916
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A decoupling capacitor is attached directly to an IC lead frame and thereafter encapsulated within a molded package along with an IC chip resulting in a decoupling scheme which is internal to the molded IC package. The capacitor preferably comprises a thin layer of ceramic dielectric sandwiched between top and bottom conductors. The top conductor may be attached to the die bar of the lead frame using an electrically non-conductive or conductive adhesive. Leads extending from the capacitors are attached to appropriate fingers of the lead frame by welding, soldering or the like to effect strong mechanical and electrical contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.