Mounting of high density components on substrate
US4994938A · kind A · utility
15Cited by
1References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 28, 1988 |
| Grant date | Feb 19, 1991 |
| Priority date | — |
| Expiry date | Dec 28, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board or other substrate mounts electrical components substantially coplanar with the median plane or thickness of the board or substrate. The board furnishes an opening having bonding pads plated through the opening and fixed on the opposite sidewalls of the opening. The electrical component becomes placed in the the opening with solder paste between the bonding pads and end terminals of the electrical component. Reflow soldering techniques melt the solder paste into solder filets that solidify to fasten the electrical component within the opening in coplanar with the median plane or thickness of the board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.