Daniel Baudouin
15Patents
12h-index
10Co-inventors
75Inventor score
Filing activity: Feb 27, 1974 → Sep 20, 1999
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6373127B1 | Integrated capacitor on the back of a chip | Electricity | 204 | Expired |
| US5483024A | High density semiconductor package | Electricity | 84 | Expired |
| US4975763A | Edge-mounted, surface-mount package for semiconductor integrated circuit devices | Emerging Cross-Sectional Technologies | 78 | Expired |
| US5208732A | Memory card with flexible conductor between substrate and metal cover | Electricity | 54 | Expired |
| US5352851A | Edge-mounted, surface-mount integrated circuit device | Emerging Cross-Sectional Technologies | 41 | Expired |
| US5414253A | Integrated circuit card | Physics | 31 | Expired |
| US5260601A | Edge-mounted, surface-mount package for semiconductor integrated circuit devices | Emerging Cross-Sectional Technologies | 30 | Expired |
| US5432678A | High power dissipation vertical mounted package for surface mount application | Electricity | 27 | Expired |
| US5637828A | High density semiconductor package | Electricity | 27 | Expired |
| US6040983A | Vertical passive components for surface mount assembly | Electricity | 19 | Expired |
| US4994938A | Mounting of high density components on substrate | Emerging Cross-Sectional Technologies | 15 | Expired |
| US5387814A | Integrated circuit with supports for mounting an electrical component | Emerging Cross-Sectional Technologies | 15 | Expired |
| US5275975A | Method of making a relatively flat semiconductor package having a semiconductor chip encapsulated in molded material | Emerging Cross-Sectional Technologies | 8 | Expired |
| US5671125A | Vertical package mounted on both sides of a printed circuit board | Emerging Cross-Sectional Technologies | 8 | Expired |
| US3970995A | Slaving calculator chips | Physics | 5 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.