Multi-metal layer interconnect tape for tape automated bonding
US4997517A · kind A · utility
64Cited by
15References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 9, 1990 |
| Grant date | Mar 5, 1991 |
| Priority date | — |
| Expiry date | Jan 9, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-metal layer interconnect tape is provided. The tape is not supported by a dielectric carrier. A thin dielectric adhesive layer separates at least two self supporting metal foil layers. In one embodiment of the invention, conductive vias electrically interconnect leads formed in a first metal foil layer with ground and power circuits formed in a second metal foil layer. The metal foil layers are in close proximity so the vias have a low aspect ratio. The vias may be readily coated with continuous film of a conductive metal and are much easier to clean than conventional vias having significantly higher aspect ratios.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.