Wire-bonding method, wire-bonding apparatus, and semiconductor device produced by the wire-bonding method
US4998002A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 26, 1988 |
| Grant date | Mar 5, 1991 |
| Priority date | — |
| Expiry date | Jan 26, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is fabricated by placing a semiconductor chip with at least one bonding pad on the bonding stage of a wire bonder. A coated wire on a spool is passed through a bore in a bonding capillary so that one end of the wire projects from the lower tip of the capillary. An electrical arc discharge is created between the wire tip projecting from the capillary and a discharge electrode by applying a first electric potential to this wire tip through the opposite end of the wire and applying a second electric potential to the electrode. A ball is formed on the end of the wire and this ball is bonded to the pad with the lower tip of the capillary.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.