Clad metal lead frame substrates
US5001546A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 27, 1983 |
| Grant date | Mar 19, 1991 |
| Priority date | — |
| Expiry date | Jul 27, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit assembly for electrical applications is disclosed. The assembly includes a lead frame formed from a composite structure. The composite structure comprises a substrate formed of a nickel-iron alloy. A cladding is bonded to opposite surfaces of the substrate. The cladding consists essentially of about 15% to about 70% nickel and the balance essentially copper. The resulting lead frame has a coefficient of thermal expansion of about 50 to about 100 in/in/.degree.C. A second embodiment of the integrated circuit assembly also relates to a lead frame formed from a composite structure. The composite structure comprises a substrate formed of a nickel-iron alloy. A cladding material is bonded to opposite surfaces of the substrate for providing the circuit assembly with relatively high electrical and thermal conductivity. A second cladding is bonded to opposite surfaces of the first cladding so that the lead frame has a coefficient of thermal expansion of about 50 to about 100 in/in/.degree.C. and a thermal conductivity of about 30 to 75 B.T.U./ft.sup.2 /ft/hr/.degree.F.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.