Semiconductor card which can be folded
US5004899A · kind A · utility
57Cited by
4References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 14, 1989 |
| Grant date | Apr 2, 1991 |
| Priority date | — |
| Expiry date | Apr 14, 2009 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K19/077
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A thin semiconductor card, such as an IC card, includes a card main body, and a semiconductor module mounted therein. A foldable part or member is provided permitting the card main body to be folded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.