Patent · US Expired

Microwave cathode sputtering arrangement

US5006219A · kind A · utility

23Cited by

4References

11Claims

0Family size

Assignee

Leybold GmBH · DE

Inventors

Rudolf Latz · Rodgau, DE
Michael Scherer · Crimmitschau, DE
Michael Geisler · Apolda, DE
Michael Jung · Frankfurt am Main, DE

Key dates

Filing date	Sep 28, 1989
Grant date	Apr 9, 1991
Priority date	—
Expiry date	Sep 28, 2009

Classification

Technology area (CPC H)Electricity
CPC primaryH01J37/3405
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

The invention relates to a microwave cathode sputtering arrangement in which a cathode is disposed opposite a substrate. In the immediate vicinity of the substrate is located at least one magnetic field whose strength leads to an electron cyclotron resonance.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.