Hydantoin or barbituric acid-extended epoxy resin composition
US5006615A · kind A · utility
0Cited by
4References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 15, 1990 |
| Grant date | Apr 9, 1991 |
| Priority date | — |
| Expiry date | Jun 15, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0326
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A modified epoxy resin composition for use in making a printed circuit board comprising: (1) a modified epoxy resin obtained by reacting (a) a low molecular weight epoxy resin having at least two epoxy groups which have the following formula, ##STR1## (b) a mono-nucleus chain extending agent containing N-heterocyclic fatty groups and at least two active hydrogen atoms and represented by the formulas, ##STR2## and (c) at least one catalyst for catalyzing the reaction between components (a) and (b).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.