Ker-Ming Chen
9Patents
4h-index
10Co-inventors
43Inventor score
Filing activity: Dec 8, 1988 → Jul 10, 1992
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5041519A | Composition comprising epoxy resin, bismaleimide and barbituric acid | Chemistry; Metallurgy | 9 | Expired |
| US5326794A | Barbituric acid-modified bismaleimide with diamine and polyisocyanate-modified epoxy resin | Chemistry; Metallurgy | 8 | Expired |
| US5200474A | Polyimide adhesive composition including barbituric acid modifier | Emerging Cross-Sectional Technologies | 7 | Expired |
| US5112926A | Thermal-resistant resin composition for printed circuit boards based on triazine modified epoxy resin blends | Electricity | 4 | Expired |
| US5217599A | Bonding of polyimide film | Electricity | 2 | Expired |
| US5130407A | Hydantoin or barbituric acid-extended epoxy resin | Electricity | 1 | Expired |
| US5342736A | Method of wet etching of polyimide | Electricity | 1 | Expired |
| US5414059A | Low bromine-content materials for manufacturing printed circuit boards | Chemistry; Metallurgy | 0 | Expired |
| US5006615A | Hydantoin or barbituric acid-extended epoxy resin composition | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.