Power semiconductor switching apparatus with heat sinks
US5006921A · kind A · utility
11Cited by
0References
77Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 1989 |
| Grant date | Apr 9, 1991 |
| Priority date | — |
| Expiry date | Mar 31, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor switching apparatus includes a member for radiating heat generated from semiconductor switching element chips and for reducing a thermal stress. The lengths of gate electrode wires are equally set. The semiconductor switching apparatus has a large capacity and good switching characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.