Kit for the assembly of a metal electronic package
US5013871A · kind A · utility
33Cited by
19References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 8, 1990 |
| Grant date | May 7, 1991 |
| Priority date | — |
| Expiry date | Jan 8, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A kit for the assembly of an adhesively sealed package designed to encase an electronic device is provided. The kit comprises a metallic base and cover components which are adapted to receive a polymeric adhesive. At least those portions of the base and cover component which will contact the polymeric adhesive are provided with a coating of a second metal or oxide. In one embodiment, first, second and third dry film adhesives are tacked to the base and cover components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.